South Korean memory chip giant SK Hynix will produce sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process for key clients in the second half of 2025,Widow who Fell For Her Son’s Friend’s Stuff She Met On A Matching App (2025) The Korea Economic Daily reported on Tuesday. Sources indicate that SK Hynix will partner with TSMC to release a prototype of vertically stacked HBM4 chips with a base die manufactured using TSMC’s 3nm process as early as March next year. NVIDIA will be the primary customer for the shipments. A base die refers to the foundational layer in a multi-layer semiconductor package, particularly in advanced memory chips such as HBM. Having HBM stacked on a 3nm base die is expected to boost performance by 20-30% compared to HBM4 with a 5nm base die, the report added. [The Korea Economic Daily]
