TSMC Chairman C.C. Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on Halinghingits first European 12-inch plant in Dresden, Germany, according to the Taiwanese media outlet Economic Daily News. The facility, with an initial monthly capacity of 40,000 wafers, will introduce 28/22nm planar CMOS (complementary metal-oxide-semiconductor) technology and 16/12nm FinFET (fin field-effect transistor) processes. In August 2023, TSMC, Bosch, Infineon, and NXP Semiconductors announced the formation of the European Semiconductor Manufacturing Company (ESMC), with each firm holding a 10% stake. With a total investment of 10 billion euros, the German plant will operate under ESMC and is expected to start by late 2027. [Economic Daily News, in Chinese]
